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Usman Harahap
Universitas Medan Area
Articles
2
Documents
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Fluid Structure Interaction Numerical Simulation of Wiresweep in Electronics Packaging

TELKOMNIKA (Telecommunication Computing Electronics and Control) Vol 13, No 2: June 2015
Publisher : Universitas Ahmad Dahlan

Show Abstract | Original Source | Check in Google Scholar

Abstract

This paper presents the computational of two-way fluid structure interaction technique by using Mesh based Parallel Code Coupling Interface for the visualization of wiresweep in the electronics packaging. Polymer rheology with Castro-Macosko model have been used in the fluid flow model and Volume of Fluid technique was applied to melt front tracking of the fluid. The numerical analysis used User-Defined Function to allow curing kinetic model. Wiresweep profiles and pressure distribution within the mold are presented. The numerical results of melt front patterns and filled volume were compared with the previous experimental results and found in good agreement.

Fluid Structure Interaction Numerical Simulation of Wiresweep in Electronics Packaging

TELKOMNIKA (Telecommunication Computing Electronics and Control) Vol 14, No 1: March 2016
Publisher : Universitas Ahmad Dahlan

Show Abstract | Original Source | Check in Google Scholar | Full PDF (830.342 KB)

Abstract

This paper presents the computational of two-way fluid structure interaction technique by using Mesh based Parallel Code Coupling Interface for the visualization of wiresweep in the electronics packaging. Polymer rheology models with Castro-Macosko model have been used in the fluid flow model and Volume of Fluid technique was applied to melt front tracking of the fluid. The numerical analysis used User-Defined Function to allow curing kinetic model. Wiresweep profiles and pressure distribution within the mold are presented. The numerical results of melt front patterns and filled volume were compared with the previous experimental results and found in good agreement.